Dynatron R15 Intel Socket 2011 1U Vapor Chamber Heatsink
Product details
| Management number | 205085544 | Release Date | 2025/10/18 | List Price | US$87.30 | Model Number | 205085544 | ||
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Passive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors.
Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R15 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R15 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.
What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.
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